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Liquid Metal

TIM-LIQUID-I

TIM-LIQUID-I

成分 GaInSn
伝導熱系数 >25W/m·K
仕様書 1g, 5g, 100g, 1000g
伝導率 4 X 10^6 S/m
粘度 4200 mPa·s
働く温度 -50℃~600℃
ボラティリティ <0.001%
腐食性 Aluminum corrosion

TIM-LIQUID-Pro

TIM-LIQUID-Pro

成分 GaInSnZn
伝導熱系数 >30W/m·K
仕様書 1g, 5g, 100g, 1000g
伝導率 8 X 10^6 S/m
粘度 4200 mPa·s
働く温度 -50℃~600℃
ボラティリティ <0.001%
腐食性 Aluminum corrosion

TIM-LIQUID-Ultra

TIM-LIQUID-Ultra

成分 GaInSnZn
伝導熱系数 >35W/m·K
仕様書 1g, 5g, 100g, 1000g
伝導率 8 X 10^6 S/m
粘度 4200 mPa·s
働く温度 -50℃~600℃
ボラティリティ <0.001%
腐食性 Aluminum corrosion

製品紹介

The Liquid Metal is made of 100% metal material and is liquid form at room temperature. Its raw materials includes Gallium, Indium, Tin, Zinc, Silver, etc. There is two research directions of Liquid Metal, one is Amorphous Alloy (Bulk Metal Glass) which is solid metal at room temperature with amorphous atomic structure and normally metal surface. Amorphous Alloy has good yield strength and elastic limit, and the main material is Zirconium base amorphous alloy. The another is Gallium base alloy, which is liquid and fluid and non toxic alloy. The Liquid Metal (Gallium Base Alloy) has greater thermal conductivity and electrical conductivity, and it can be controlled by micron-current and magnetic force, it is good to be used in Flexible Printed Circuit Board, mercury-free thermometer, thermal conductive material, drug carrier, micro electrode, etc. Compared with traditional thermal conductive materials, and has excellent heat dissipation performance. With remarkable stability and reliability, it is very good to used in the field of CPU/GPU cooling, high temperature and heat flow, and is a great substitute of Silicone Grease. In addition to the high thermal conductivity of all metals, those in the liquid form will also exhibit low interfacial resistance ensuring that they can dissipate heat quickly. Meanwhile, it is compatible with copper and stainless steel without emitting organic substance.

製品の使用

Liquid metals is certainly RoHS conformable and absolute nontoxic, and is used in in specific heat transfer systems, thermal cooling and heating designs, thermostats, flexible printed circuit board (FPCB), switches, barometers. It can be directly coated on the surface between heat source (CPU/GPU) and heat radiator in thickness of 0.1mm to 0.2mm for fast cooling.

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