The low melting point alloy series generally contains Bi, Pb, Sn, Cd, In, Ga, Zn, Sb, and other low melting point alloys, also known as "fusible alloys". It is generally believed that their melting points are all below 310°. According to the characteristics of its melting point, it can be divided into two categories: one is called eutectic alloy, and the other is non-eutectic alloy. The melting point of all low melting point alloys is lower than the melting point of any of the pure metals of the alloys formed. The melting point of the eutectic alloy is stable. The melting point (flow temperature) of the non-eutectic alloy varies depending on the test method, the quality of the alloy, the measurement position, the heating rate, and other factors.
Thermal interface materials have the following characteristics:
(1) High thermal conductivity;
(2) High flexibility, ensuring that the material can fill the gap of the contact surface most fully under the condition of low installation pressure, and the contact thermal resistance between the thermal interface material and the contact surface is small;
(4) Easy to install and detachable;
(5) Wide applicability, can be used to fill small gaps, but also to fill large gaps.