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A thermal pad is part of a thermal system. How does a thermal pad dissipate the heat generated by the CPU? First, it is important to understand that there are three types of heat conduction: conduction, convection and radiation.Conduction refers to the exchange of kinetic energy between molecules, the collision of lower energy particles and higher energy particles to obtain energy (through direct physical contact), a single piece of heat conduction is not able to achieve heat conduction. In a word, conduction is the most important way that the heat conductor gets heat from the CPU.Convection is the transfer of heat through the movement of hot matter. It means that heat comes from a source of heat surrounded by a gas or liquid, which is transferred by the movement of molecules. We can achieve forced convection by adding a fan to the heat conducting sheet. Convection is the main mode of fan/heat exchanger combination refrigeration. Most of the heat generated by the CPU is carried away by the convection formed by the fan, and only a very small amount of the heat is emitted through radiation.In order to achieve this effect, a heat conductor must be designed to enhance the effect.Two methods are usually used to achieve this: the surface area of the heat conductor is increased as much as possible to facilitate the flow of air. The use of metal fins not only increases the heat conduction area, but a good metal fin design also makes convection more efficient. Make the contact surface between the thermal pad and the CPU as smooth as possible, otherwise, the thermal insulation layer will be formed between the CPU and the thermal pad. Of course, even if the contact surface is very smooth, there will inevitably be the existence of gaps, therefore, in the contact place can use thermal paste, thermal silicon grease or special thermal patch as an aid to improve the contact area.Radiation, as the name suggests that heat is emitted directly from a heat source in the form of an electromagnetic field (transmitted by photons). Radiation can take place in a vacuum. The heat transfer efficiency of radiation depends on the material of the heat source and the color of the surface.

Are the liquid metal thermal pastes that be used in CPUof laptop dangerous and corrosive?In few years ago, people blurry think that liquid metal thermal paste could corrode the radiator and conduct electricity, no one to use it. That's because people don't know much about liquid metal thermal paste.But the truth is use of liquid metal thermal paste on the CPU is obviously better than the currently available heatconduction grease. Not only is it not corrosive, but as it doesn’t need additional protection, as long as it's used correctlyAs shown at right, it is the effect sketch of the liquid metal thermal paste on the CPU, the gray metal who looks like plasticine actually is insulating material. it can prevent the conductive effectively. For the CPU, it doesn’t require additional protection as long as the cover is not opened and the liquid metal is applied not too much. Liquid metal thermal paste is not corrosive. As long as it uses properly and evenly, the effect after use is also very prominent.Caution: Do not use too much liquid metal thermal paste on the CPU. Do a good job of insulation protection, open the cover with caution. In recent years, with the development of electronic devices toward higher integration, the heat generated in the unit area has continued to rise.In order to meet requirements of heat dissipation, the heat product by electronic devices needs to be conducted to the heat sink firstly and then emitted from the heat sink to the air.However, there are a large number of extremely uneven potholes between the surface of the electronic device and the heat sink.Therefore, people generally adopt the thermal interface material with high-thermal conductivity to fill the potholes, and the air in it is eliminated.Thus establishing a heat conduction channel between the surface of the electronic device and the heat sink.A new type of liquid metal filled thermal conductive silicone grease can be product by f filling liquid metal into a silicone oil matrix.The results of the study show that the thermal conductivity of liquid metal filled silicone grease is eminently better than the currently available thermal grease.

TIM-PASTE-I, TIM-PASTE-Pro, TIM-PASTE-Ultra are liquid metal thermal compound based on eutectic alloy. It is a viscous thermal grease with 100% metal content. The thermal conductivity is above 20w/mk. It has very good adhesion and high temperature resistance. It is non-flowing, non-volatile and non-oxidizing can work very well even under high temperature environment. It is an ideal alternative to silicone grease. It can also be used for IGBT and large LED cooling, power battery cooling, CPU / GPU cooling, and can maintain high thermal conductivity and safety for a long time.TIM-PASTE produced by Sinoma Shengte is an environmentally friendly product that complies with the European Union's ROHS standards. It can be used in conduction systems, heat conduction cooling, thermal design, temperature adjustment devices, flexible printed circuit boards, switches, barometers, etc. Liquid metal can also be directly applied between the CPU / GPU and the heat sink, as a sufficient filling material for the contact surface, which plays a role of rapid cooling.Liquid metal, whether you apply it in paste or solid form. It will become liquid at high temperature and condense to solid at low temperature (it will not work after shutdown).It should be noted that when applying to the CPU, do not spill liquid metal on the motherboard. Liquid metal designed by Sinoma Shengte is very suitable for application and is equipped with cleaning materials to ensure that you can protect yourself during the application process. CPU. Welcome to visit our website or contact ourengineers to communicate any technical problems you may encounter during use.

TIM-PAD-I, TIM-PAD-PRO, TIM-PAD-ULTRA are metal material with a melting point between 58 and 60 degrees. When the operating temperature of the CPU / GPU is higher than this range, the metal thermal conductive sheet can also be used to replace aluminum and copper sheets, which is an environmentally friendly product that complies with the EU ROHS standard.The heat dissipation performance of metal thermal pad is 60-70 times of water. Based on the unique thermal physical properties of low melting point metals, it can be widely used not only in the chip thermal management of high-performance servers, desktops, industrial computers, notebook computers, and communication base stations. , And also plays an indispensable role in many key areas, such as: advanced energy fields (industrial waste heat utilization, solar thermal power generation, focused photovoltaic cell cooling, fuel cells), aviation thermal control fields (satellite, thermal protection), photovoltaic devices (Projectors, power electronics), LED lighting, micro / nano electromechanical systems, biochips, and electric vehicles, etc., have great industrial applications. High-end applications determine the high standards of product quality, accuracy, and appearance. In order to meet such a large market demand, stricter requirements have been placed on the production method of metal thermal conductive sheets. Santech can follow the customer's requirements to produce metal thermal pad of different sizes and shapes, including rectangular, circular, triangular, and can customize metal thermal conductive sheets of different melting points to achieve customer use in different environments.

Metal thermal pad 's typical structure of the combination onto the fan is that a number of sheet heat conducting fins are engaged in a certain process on the heat-absorbing bottom with a certain thickness.Disadvantages: the airflow needs to change the direction in the thermal plate, which is easy to form a "no wind zone". Moreover, the overhead type of the traditional axial flow fan is easy to form a dead Angle -- "wind blind zone" -- in the part of the inter-bearing, but the thermal plate is in the center of the contact is the heating equipment (CPU core, etc.). A typical metal thermal pad design, with a solid copper column as the main shaft, radiates the thermal fin outward from the inside, and inversely bends the fin towards the fan to increase contact with the airflow. With this kind of design, the blind area of the axial flow fan just corresponds to the copper core of the thermal conductor, and the copper core itself has a small exposed surface area, which is difficult to improve the thermal conductivity with the aid of airflow. Meantime, some of the outer fins are just under the fan's strong wind, the thermal effect of nature excellent. Its design can be said to be an "evasive" approach: the wind blind area is avoided by clever design, minimizing the negative impact brought by it; And compared to the "conventional turbo" fan mentioned later, the copper core has a larger contact area with the thermal fins, which can better transfer heat to all parts of the fins.


How to use thermal paste correctly?In case of the CPUA. Clean the CPU core and radiator surface with a high purity solvent such as high purity iso-amyl alcohol or acetone and a flurry-free cloth such as a cloth used for wiping lenses (a fingerprint may be about 0.005 inches thick).If the surface is clean without oil, this step can be skipped, if there is more difficult to clean the oil, can use precision electrical cleaner cleaning, will not be in conflict with thermal paste.B. Determine the area where the CPU is in contact with the heat sink and squeeze enough thermal paste into the center of the area.C. Using a clean tool, remove a small amount of thermal paste and transfer it to the corner of the CPU core. You only need a small piece, about half the size of a grain of rice.D. Slip your fingers into the plastic bag, then rub the thermal paste on the bottom of the radiator with your fingers until the thermal paste evenly covers the entire area in contact with the CPU.Ensure that the thermal paste can fill the bottom of the radiator gap and uneven places.Note: do not apply directly with your fingers.E. With no flannelette will be wiped off the heat conduction paste at the bottom of the radiator, at this time you can see the heat conduction paste at the bottom of the radiator and other areas color is not the same, indicating that heat conduction paste has evenly filled the gap in the base.F. Start with the tool at the corner of the CPU core and spread the thermal paste evenly throughout the core.The flatter the surface to be contacted, the thinner the need for thermal paste.For an ordinary radiator underside, the thermal paste is about the thickness of a piece of regular paper (0.003-0.005 inches). If the radiator underside is bright and flat, the thermal paste can be as thin as translucent. G. Make sure there are no foreign bodies on the radiator base and CPU core surface. Place the radiator on the CPU. At this point, only press lightly and do not rotate or shift the radiator.Otherwise, it may lead to uneven thickness of thermal paste between the radiator and CPU.If there is no metal thermal paste on the CPU, which problems will occur?Metal Thermal paste is the heat conduction material of electronic components, such as the gap between the processor CPU and the radiator, the filling of the gap between the high-power transistor, SCR element diode and the material (copper, aluminum), the assembly of transistors, CPU;Temperature sensor;Automotive electronic parts, automotive refrigerator, power module, printer head, electronic appliances, audio crystal cooling, reduce the operating temperature of heating components, increase the life of the crystal.Thermal paste has excellent heat resistance, electrical insulation, thermal conductivity, damping, and viscosity is not sensitive to temperature.Its chemical properties are stable, volatile, non - toxic and tasteless. If there is no metal thermal paste on the CPU, some serious problems will occur as below:A. If there is no heat conduction paste between the CPU and the radiator, although the computer can be turned on, but the full load temperature is very high, resulting in the running speed will become very slow, believe that now basically everyone has a computer, under the same conditions, the CPU temperature, the operation of the computer light and easy to see can be seen.B. It is recommended to apply thermal paste, because the difference between thermal paste and no thermal paste can be up to 30℃, the stability of the system is greatly affected.C. The material of thermal paste also affects the thermal conductivity, such as ordinary thermal paste and gallium based alloy thermal paste, thermal conductivity difference will directly affect the service life of the heating original. However, heat conduction paste also has service life, the service life of general heat conduction paste can reach more than a year.When found that the CPU began to heat, it means that the heat dissipation performance of thermal paste began to decline, in order to CPU life safety, thermal paste is essential.

low melting pointAt present, the main cooling technology is air cooling, heat pipe, water cooling and so on.Air cooling technology has limited thermal conductivity and can only be applied to low-power electronic products.The heat pipe is better than the air cooling, but there is the burning limit, and even the pipe rupture failure phenomenon;Due to evaporation, leakage and other problems in the process of operation, water-cooled cooling is easy to lead to device aging, and the requirements for liquid and flow pipe are also high.The radiator that liquid metal makes has the advantage that this traditional radiator cannot compare, that is collect efficient, compact, safe, quiet in an organic whole.It has good thermal conductivity and specific heat capacity, but the volume does not increase at all. The same volume brings better performance, and the compactness is vividly reflected.Liquid metal will not leak, not easy to evaporate, will not deteriorate, safe operation, long service life.Due to the built-in electromagnetic pump in the heat dissipation pipeline, the pressure gradient is generated by the electromagnetic force to push the liquid forward without any noise, so that users can enjoy the silent radiator.The alloy of gallium metal is used as the heat conducting agent of radiator, with low melting point, non-toxic and harmless, fast heat absorption and high boiling point.Liquid metal cooling technology can not only be applied toCPUcooling, its core technology can be extended to more aspects, including the instrument industry, steel manufacturing, solar energy capture, national defense, etc. Due to the wide application of various kinds of chips and optoelectronic devices, the corresponding cooling technology has a huge market demand.According to the data, the world market for manufacturing components such as fans and fins used in computer cpus, for example, is about $5 billion to $10 billion a year. With the increasing power consumption, the price of chipcoolingsolutions has also increased dramatically, and the corresponding market demand has also increased. This undoubtedly provides the broad development space for the liquid metal heat dissipation technology.

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