Galinstan is a brand-name and a common name for a liquid metal alloy whose composition is part of a family of eutectic alloys mainly consisting of gallium, indium, and tin. Such eutectic alloys are liquids at room tem`perature, typically melting at +11 °C (52 °F), while commercial Galinstan melts at −19 °C (−2 °F).An example of a typical eutectic mixture is 68% Ga, 22% In, and 10% Sn (by weight) though proportions vary between 62–95% Ga, 5–22% In, 0–16% Sn (by weight) while remaining eutectic; the exact composition of the commercial product “Galinstan” is not publicly known.Due to the low toxicity and low reactivity of its component metals, galinstan finds use as a replacement for many applications that previously employed the toxic liquid mercury or the reactive NaK (sodium–potassium alloy).Physical properties·Boiling point: > 1300°C· Melting point: −19°C· Vapour pressure: < 10−8 Torr (at 500°C)· Density: 6.44 g/cm3 (at 20°C)· Solubility: Insoluble in water or organic solvents· Viscosity: 0.0024 Pa·s (at 20°C)· Thermal conductivity: 16.5 W·m−1·K−1· Electrical conductivity: 3.46×106 S/m (at 20°C)· Surface tension: s = 0.535 - 0.718 N/m (at 20°C, dependent on producer)· Specific heat capacity: 296 J·kg−1·K−1Galinstan tends to be “wet” and adhere to many materials, including glass, which limits its use compared to mercury.UsesGalinstan is commercially used as a mercury replacement in thermometers due to its nontoxic properties, but the inner tube surface must be coated with gallium oxide to prevent the alloy from wetting the glass surface.Galinstan has higher reflectivity and lower density than mercury. In the field of astronomy it is considered as a replacement for mercury in liquid mirror telescopes.Galinstan may be used as a thermal interface for computer hardware cooling solutions, though major obstacles for widespread use are its cost and aggressive corrosive properties (it corrodes many other metals such as aluminium by dissolving them). It is also electrically conductive, and so needs to be applied more carefully than regular non-conductive compounds.It is difficult to use for cooling fission-based nuclear reactors, because indium has a high absorption cross section for thermal neutrons, efficiently absorbing them and inhibiting the fission reaction. Conversely, it is being investigated as a possible coolant for fusion reactors. Unlike other liquid metals used in this application, such as lithium and mercury, the nonreactivity makes galinstan a safer material to use.
Afusible alloyis ametalalloycapable of being easilyfused, i.e. easily meltable, at relatively low temperatures. Fusible alloys are commonly, but not necessarily,eutecticalloys. Sometimes the term "fusible alloy" is used to describe alloys with amelting pointbelow 183°C (361°F; 456K). Fusible alloys in this sense are used forsolder.IntroductionLow-melting alloys can be divided into the following categories:1. Mercury-containing alloys2. Only alkali metal-containing alloys3. Gallium-containing alloys (but neither alkali metal nor mercury)4. Only bismuth, lead, tin, cadmium, zinc, indium, and sometimes thallium-containing alloys5. Other alloys (rarely used)6. Some reasonably well-known fusible alloys are Wood's metal, Field's metal, Rose metal, Galinstan, and NaK.Applications Melted fusible alloys can be used as coolants as they are stable under heating and can give much higher thermal conductivity than most other coolants; particularly with alloys made with a high thermal conductivity metal such as indium or sodium. Metals with low neutron cross-section are used for cooling nuclear reactors.related articles:New composite material-low melting alloy
As the functions of intelligent devices in the 5G era become more and more complex, the integration of chips and modules and the density of components increase dramatically, resulting in the continuous increase in power consumption and heating density of devices. Therefore, new heat-conducting materials have become an important research topic.Liquid metal thermal interface materials have become popular because of their high thermal conductivity, good wettability, stability, and wide applicability of materials that can fully fill the void of the contact surface under low installation pressure.Liquid metal forming process and control, hydraulic characteristics and flow conditions of liquid metal filling process filling process has a great impact on the casting quality and may cause a variety of defects, such as cold insulation, inadequate pouring, inclusion, porosity, sand inclusion, sand adhesion and other defects, are generated in the case of unfavorable liquid metal filling.It is very important to design the pouring system to make the liquid metal fill the mold cavity smoothly and reasonably.Only mercury is a liquid metal, while gallium, rubidium and cesium are low-melting metals. In the field of electronics, liquid metal can be used as ink for 3D printing to directly generate electronic circuits. Compared with traditional metal, its printing temperature and equipment cost are greatly reduced, and manufacturing time is shortened, which can realize personalized customization.In medicine, liquid metals have good biocompatibility with the body and can be used to connect electrical signals to repair broken nerves.In the mechanical field, compared with traditional polymer materials, liquid metal is self-driven, deformable, and able to run and jump, providing a path for the development of flexible robots.In terms of heat dissipation of high power density devices, the heat transfer performance of liquid metal is obviously better than that of conventional working media such as water.At a low flow rate, the device surface temperature can be kept low, suitable for cooling products and cooling solutions in the cooling field and market areas with cooling needs.
What is a liquid metal thermal paste?Liquid metal thermal paste is a paste-like material with metallic characteristics.It has the following characteristics:1.High thermal conductivity2. Good adhesion3. High temperature resistance4. Does not flow at high temperatures5. Non-volatile6. Does not oxidize7. Does not cure at room temperature8. Conductive9. Non-flammable and explosive10. Non-toxic environmental protectionApplication fields of liquid metal thermal paste.Liquid metal thermal pastes can be used in magical aerospace and Computer configuration, and much more. This is a novel in recent years, and its thermal conductivity is far superior to traditional silicone oil-based silicone grease.The method of use is to first clean the surface of the object, take out a small amount of liquid metal thermal paste, and apply it evenly on the surface.It is also a pure metal paste-like thermal interface material, which has super high thermal conductivity and stability, can break through the traditional thermal interface materials, and has excellent thermal conductivity. Widely used for heat dissipation of electronic equipment in high temperature and high density heat flow occasions.How often to replace theliquid metal thermal paste?After testing, the performance of the liquid metal thermal paste used on the CPU for more than 2 years has not deterioratedIt can be seen that the liquid metal thermal paste has a long service life.NOTICE: Liquid metal is conductive, novices need to do a good job to insulation, and don’t put liquid metal with aluminum and aluminum alloyLiquid metal thermal paste and thermally conductive silicone greaseSilicone grease filling effectFor safety considerations, the conductivity of silicone grease must be very weak. Therefore, some silver and aluminum will be added on the basis of aluminium oxide to improve the thermal conductivity. Due to the smallest particles still can’t fill the gap completely, the effect of silicone grease is very limited.Advantages of liquid metals Even if the traditional silicone grease doesn’t care about the conductivity, full use of metal powder is useless. The cost of moving from micron to nanometre will increase exponentially, but the performance will be not very strong.Metals are directly composed of atoms, and the atoms are connected by metal bonds. Since the outer layer of the gallium atom has only three electrons, the force of constraining between the atoms is very weak, so the gallium-based alloy can be in a liquid state at normal temperature.Liquid metalfilling effectNanometrethermalpasteThe performance of liquid metal is modified by a special process. The metal thermalpaste made by adding nanometre metal particles is a 100% thick metal thermal grease with a thermal conductivity that more than 20 W / m · K, it’s veryadhesive and heatresisting. It will not flow, evaporate, oxidize or dry out in high temperature environments. It is an ideal thermally conductive material to replace silicone grease. It can also be used for IGBT and large LED cooling, power battery cooling, CPU / GPU cooling, and can maintain high thermal conductivity and safety for a long time. Metal thermal paste is a non-toxic product that complies with EU RoHS standards. It can be directly applied between the heat source and the heat sink, which can completely fill the gap and take advantage of the high thermal conductivity of the metal. The applied thickness can be between 0.01 mm and 0.2 mm. At the same time, the liquid metal does not react with copper and stainless steel, so that the safety and service life of the contact device can be achieved. ingredientGaInSnAgZnThermal conductivity>20W/m·KPackaging specifications5g, 10g, 100gConductivity3 X 106S/mViscosity8000 mPa·sOperating temperature-50℃～600℃Volatility
TIM-PASTE-I, TIM-PASTE-Pro, TIM-PASTE-Ultra are liquid metal thermal compound based on eutectic alloy. It is a viscous thermal grease with 100% metal content. The thermal conductivity is above 20w/mk. It has very good adhesion and high temperature resistance. It is non-flowing, non-volatile and non-oxidizing can work very well even under high temperature environment. It is an ideal alternative to silicone grease. It can also be used for IGBT and large LED cooling, power battery cooling, CPU / GPU cooling, and can maintain high thermal conductivity and safety for a long time.TIM-PASTE produced by Sinoma Shengte is an environmentally friendly product that complies with the European Union's ROHS standards. It can be used in conduction systems, heat conduction cooling, thermal design, temperature adjustment devices, flexible printed circuit boards, switches, barometers, etc. Liquid metal can also be directly applied between the CPU / GPU and the heat sink, as a sufficient filling material for the contact surface, which plays a role of rapid cooling.Liquid metal, whether you apply it in paste or solid form. It will become liquid at high temperature and condense to solid at low temperature (it will not work after shutdown).It should be noted that when applying to the CPU, do not spill liquid metal on the motherboard. Liquid metal designed by Sinoma Shengte is very suitable for application and is equipped with cleaning materials to ensure that you can protect yourself during the application process. CPU. Welcome to visit our website or contact ourengineers to communicate any technical problems you may encounter during use.
low melting pointAt present, the main cooling technology is air cooling, heat pipe, water cooling and so on.Air cooling technology has limited thermal conductivity and can only be applied to low-power electronic products.The heat pipe is better than the air cooling, but there is the burning limit, and even the pipe rupture failure phenomenon;Due to evaporation, leakage and other problems in the process of operation, water-cooled cooling is easy to lead to device aging, and the requirements for liquid and flow pipe are also high.The radiator that liquid metal makes has the advantage that this traditional radiator cannot compare, that is collect efficient, compact, safe, quiet in an organic whole.It has good thermal conductivity and specific heat capacity, but the volume does not increase at all. The same volume brings better performance, and the compactness is vividly reflected.Liquid metal will not leak, not easy to evaporate, will not deteriorate, safe operation, long service life.Due to the built-in electromagnetic pump in the heat dissipation pipeline, the pressure gradient is generated by the electromagnetic force to push the liquid forward without any noise, so that users can enjoy the silent radiator.The alloy of gallium metal is used as the heat conducting agent of radiator, with low melting point, non-toxic and harmless, fast heat absorption and high boiling point.Liquid metal cooling technology can not only be applied toCPUcooling, its core technology can be extended to more aspects, including the instrument industry, steel manufacturing, solar energy capture, national defense, etc. Due to the wide application of various kinds of chips and optoelectronic devices, the corresponding cooling technology has a huge market demand.According to the data, the world market for manufacturing components such as fans and fins used in computer cpus, for example, is about $5 billion to $10 billion a year. With the increasing power consumption, the price of chipcoolingsolutions has also increased dramatically, and the corresponding market demand has also increased. This undoubtedly provides the broad development space for the liquid metal heat dissipation technology.